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Take a peek at our newly revamped Intel Malaysia headquarters, located in the heart of Bayan Lepas, Penang! We are thrilled to unveil a fresh, innovative look that reflects our commitment to providing an exceptional working environment for our valued employees.
Pada tahun 2022, lebih daripada 4.421 pekerja berjaya mencapai 77,500 jam sukarela dalam meraikan Ulang Tahun ke-50 Intel Malaysia. Kepelbagaian, Ekuiti dan Kerangkuman Tonggak (DEI) kami telah menjadi asas utama dalam memimpin tapak Malaysia yang pelbagai cirinya ke arah menjadi tempat bekerja terpilih dan hebat di samping bercirikan tenaga ...
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16 Dis 2021 · Intel will invest more than $7 billion to build a new chip-packaging and testing factory in Malaysia, Chief Executive Pat Gelsinger said on Thursday.
2 Ogo 2023 · Intel is building a factory in Penang, Malaysia, and it will soon be the US chip giant’s first overseas facility for advanced 3D chip packaging. Intel also built a chip assembly and testing factory in another district in Malaysia as part of a US$7 billion expansion.
19 Jan 2023 · DAVOS, Switzerland: Intel Corporation (Intel Corp), the US-based chip maker has reiterated its commitment with investment of more than RM30 billion to expand its operations in Penang and Kulim, Kedah.
17 Dec 2021. Intel Corporation’s (Intel) groundbreaking ceremony today marks the construction of its new production facility as part of its US$7 billion (RM30 billion) expansion project at the Free Trade Zone Phase 3 of the Bayan Lepas Industrial Park.
19 Jan 2023 · Intel has given its commitment to invest RM70 billion over the 10 years to expand its operations in Penang and Kulim, Kedah. "This investment is expected to create more than 4,000 jobs at Intel and also over 5,000 jobs in the construction sector,” said Minister of International Trade and Industry…
13 Dis 2021 · Intel CEO Pat Gelsinger is expected to announce a $7 billion investment in a new leading-edge semiconductor packaging facility in Malaysia.
16 Dis 2021 · Intel Corp will invest more than US$7bil (RM29.61bil) to build a new chip-packaging and testing factory in Malaysia, chief executive Pat Gelsinger said on Dec 16, expanding production in the ...
