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TSMC’s 3nm process is the industry’s most advanced semiconductor technology offering best power, performance, and area (PPA), and is a full-node advance from its 5nm generation. Following N3 technology, TSMC introduced N3E and N3P, enhanced 3nm processes for better power, performance, and density.
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Industry Events - 3nm Technology - Taiwan Semiconductor...
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Apr 26, 2023 · TSMC updates its roadmap for the N3 family of 3nm-class process technologies, including N3E, N3P and N3X. N3E is on schedule, N3P offers 5% performance gain, and N3X delivers extreme performance and density.
In 2017, TSMC announced it was to begin construction of the "3 nm" semiconductor fabrication plant at the Tainan Science Park in Taiwan. TSMC plans to start volume production of the "3 nm" process node in 2023.
Aug 24, 2020 · TSMC details its 3nm N3 process node, based on FinFET transistors, that promises to improve performance by 10-15% and power by 25-30% over N5. The node will enter risk production in 2021 and volume production in 2H22, with a logic area density improvement of 1.7x.
Jun 19, 2024 · TSMC has been cranking out 3nm chips for a little over a year now, but its initial run was reserved for Apple's A17 Pro chip for the iPhone as well as its M3 and M4 processors. Now TSMC is...
May 15, 2024 · TSMC's N3E node is a relaxed version of N3B, eliminating some EUV layers and completely avoiding the usage of EUV double patterning.
Sep 7, 2023 · MediaTek and TSMC announce the successful development of MediaTek's flagship Dimensity SoC using TSMC's 3nm process technology. The chip is expected to empower global devices with high performance and low power features starting in 2024.
