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  1. Raghu. Senior Principal Engineer, Cloud Software Architecture. As enterprises increasingly look to hybrid multi-cloud environments, we’re building a Software as a Service (SaaS) capability to increase trust in confidential computing, thereby accelerating the adoption of it. See related jobs.

  2. Jun 26, 2024 · Intel Kulim was established in 1995 as a manufacturerof motherboards. Today, the site encompasses five buildings and is engaged int eh assembly of processor packaging as well as being a key operations center for mobile modules. Intel Kulim is located 45 minute’s’ drive away from Penang.

  3. PENANG, Malaysia -- Intel aims to quadruple capacity for its most advanced chip packaging services by 2025, including with a new facility in Malaysia, as America's biggest chipmaker seeks to ...

  4. Aug 26, 2023 · Both of Intel’s Malaysian facilities in Penang and Kulim are involved in two aspects of the production line – assembling various components into the final product (or, officially known as packaging) and testing (ensuring all the components produced by Intel meet the standards and specifications for their customers).

  5. Sep 7, 2023 · Penang Assembly and Test (PGAT) Assembly and Test is the mainstay of Intel’s Malaysia operations, spread over its Penang and Kulim AT sites, with a third coming online in time to come. We visited the former. Here, silicon dies supplied by global Intel die sort facilities (including KuDSDP) are mounted onto PCB substrates and epoxied, before a ...

  6. Dec 14, 2021 · Penang received an early reason for Christmas cheer following reports that pioneer investor Intel Corporation Limited is set to invest up to RM30 billion to upgrade its chip manufacturing facility at the Bayan Lepas Free Industrial Zone here. Intel had set up its first production facility outside the United States on the island in 1972 ...

  7. jobs.intel.com › en › jobIntel

    Join Intel Malaysia's Internship Program and gain valuable experience in cutting-edge technology. Apply now for the 2024 intake.

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