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Lam’s SABRE ® ECD product family, which helped pioneer the copper interconnect transition, offers the precision needed for copper damascene manufacturing on the industry’s productivity-leading platform.
- SABRE 제품군 - Lam Research
Lam Capital; 환경, 사회 및 기업 지배구조 > ESG 전략 ; 환경·보건·안전; 2050...
- Advanced Memory Solutions | Our Solutions | Lam Research
Memory cells – the chip components that store electronic...
- SABRE 3D Product Family - Lam Research
Environmental Health & Safety. 2050 Net Zero Strategy....
- Electrochemical Deposition (ECD) Archives - Lam Research
SABRE Product Family Electrochemical Deposition (ECD) This...
- Lam Research Drives Technology Advancements for Next-Generation ...
Lam Research has formulated three strategies to help...
- Copper Electrodeposition for Fan-Out Wafer-Level Packaging
Lam addresses this issue with a proprietary process called...
- Lam Research Newsroom - Press Releases
SABRE Extreme marks another milestone for Novellus' SABRE...
- SABRE 제품군 - Lam Research
Environmental Health & Safety. 2050 Net Zero Strategy. Responsible Supply Chain. Our Communities. Sustainable Operations. Sustainable Product Innovation. Lam Research ESG Report. Subsidiaries. Silfex.
SABRE Product Family Electrochemical Deposition (ECD) This product family offers precision metal plating for copper damascene manufacturing on the industry’s productivity-leading ECD platform.
Jul 2, 2015 · SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications. This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication.
Nov 2, 2022 · Lam Research has formulated three strategies to help customers overcome MEMS’s high-volume manufacturing challenges: Leverage Lam’s leading-edge technology to enable MEMS process capability. Address MEMS and sensor customers’ high value challenges. Be a partner in MEMS and sensor development and process optimization.
May 11, 2020 · Lam addresses this issue with a proprietary process called Durendal®. It yields high-quality, smooth surfaces at the tops of the megapillars and uniform megapillar height across the wafer. The entire Durendal® process can be performed on the SABRE® 3D tool.
Jul 10, 2006 · SABRE Extreme marks another milestone for Novellus' SABRE Electrofill tool, the semiconductor industry's first production-worthy copper electroplating system. With a market share of 80% in 2005, SABRE is the process tool of record for nine of the top 10 copper IC producers.
